Semiconductor wafer temperature measuring device and method

Details Semiconductor wafer temperature measuring device and method Semiconductor wafer temperature measuring device and method

1986-07-07

1988-08-16

Cuchlinski, Jr., William A.

Thermal measuring and testing

Temperature measurement

By electrical or magnetic heat sensor

374 7, G01K 700

Patent

active

047640260

ABSTRACT:
A probe having four spring-loaded tips contacts the backside of a semiconductor wafer in a processing machine. A current is induced across the outer tips and a voltage proportional to the sheet resistance of the wafer is measured across the inner tips. Wafer thickness is used to convert sheet resistance to bulk resistivity. Data on resistivity as a function of temperature is used to determine wafer temperature.

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Schurman, Josef "Sensoren Fur die Automobil-Elektronik", Funkschau, 1978, Heft 14 pp. 679-682.

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