Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1992-06-01
1993-08-31
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156345, 156662, 414222, 414589, H01L 21306, B44C 122
Patent
active
052405575
ABSTRACT:
An apparatus stacks semiconductor wafers and spacers and clamps them in an axial alignment for mounting in a semiconductor wafer edge polishing machine. After edge polishing, the apparatus separates the wafers and spacers and delivers them respectively into separate cassettes for further processing or recycling.
REFERENCES:
patent: 4550239 (1985-10-01), Uehara et al.
patent: 4550242 (1985-10-01), Uehara et al.
Dyer Lawrence D.
Gullett Tom G.
Head Michael R.
McGregor Dempsey
Medders Jerry B.
Brady Wade James
Donaldson Richard
Hiller William E.
Powell William A.
Texas Instruments Incorporated
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