Semiconductor wafer protective device and semiconductor...

Details Semiconductor wafer protective device and semiconductor... Semiconductor wafer protective device and semiconductor...

2005-09-13

2005-09-13

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

With measuring or testing

Electrical characteristic sensed

Reexamination Certificate

active

06943045

ABSTRACT:
A semiconductor wafer protecting unit which enables a semiconductor wafer to be handled as required, without breakage of the semiconductor wafer, even when the back of the semiconductor wafer is ground to decrease the thickness of the semiconductor wafer markedly; and a semiconductor wafer processing method using such a semiconductor wafer protecting unit. The semiconductor wafer protecting unit is composed of a magnetized tape having one surface with tackiness, and a magnetic substrate having many pores formed at least in a central zone thereof.

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Notice Informing the Applicant of the Communication of the International Application to the Designated Offices (Form PCT/IB/308) issued in connection with PCT/JP2003/002194 (Apr. 2002).

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