Semiconductor wafer processing chamber for reducing particles de

Details Semiconductor wafer processing chamber for reducing particles de Semiconductor wafer processing chamber for reducing particles de

1997-02-03

1999-05-18

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

118723E, H05H1/00

Patent

active

059048000

ABSTRACT:
The present invention incorporates an electrically-controlled grid (250) between a liner (220) and an isolation region (252) of a processing chamber (210). The electrically-controlled grid (250) is powered during a processing step of a semiconductor substrate (230) such that particles (235) suspended in the processing chamber (212) are attracted toward the grid (250) and away from the semiconductor substrate (230). A non-adhesive liner (220) is utilized to allow particles (235) and polymers to be directed toward a pumping port (239).

REFERENCES:
patent: 5252178 (1993-10-01), Moslehi
patent: 5269881 (1993-12-01), Sekiya et al.
patent: 5366585 (1994-11-01), Robertson et al.

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