Semiconductor wafer process

Details Semiconductor wafer process Semiconductor wafer process

1983-09-27

1986-05-13

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

51281R, 156636, 156639, 156662, 156903, H01L 21306, B44C 122

Patent

active

045884730

ABSTRACT:
The edge part of a thin disc-shaped slice, i.e., wafer, transversely cut off a single-crystal semiconductor rod is bevel machine, and then the entire surface of this wafer is mirror finished. This mirror finish is obtained by carrying out chemical etching to the ordinary depth and then carryng out polishing by means of a polishing fabric. By this process, all surfaces of the semiconductor wafer are polished to a mirror finish, and the formation of dendrite crystals on any of the surfaces is inhibited.

REFERENCES:
patent: 3951728 (1976-04-01), Egashira et al.
H. Nagai et al., "Semiconductor World", (1983), pp. 53-58.

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