Semiconductor wafer polishing apparatus with a flexible carrier

Details Semiconductor wafer polishing apparatus with a flexible carrier Semiconductor wafer polishing apparatus with a flexible carrier

1997-02-13

1998-12-22

Rose, Robert A.

Abrading

Machine

Rotary tool

451398, 451289, B24B 500

Patent

active

058511407

ABSTRACT:
A carrier head for a semiconductor wafer polishing apparatus includes a rigid plate which has a major surface with a plurality of open fluid channels. A flexible wafer carrier membrane has a perforated wafer contact section for contacting the semiconductor wafer, and a bellows extending around the wafer contact section. A retaining ring is secured to the rigid plate with a flange on the bellows sandwiched between the plate's major surface and the retaining ring, thereby defining a cavity between the wafer carrier membrane and the rigid plate. A fluid conduit is coupled to the rigid plate allowing a source of a vacuum and a source of pressurized fluid alternately to be connected to the cavity.

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