Semiconductor wafer, method of manufacturing the same, and...

Details Semiconductor wafer, method of manufacturing the same, and... Semiconductor wafer, method of manufacturing the same, and...

2007-10-31

2009-11-17

Fahmy, Wael (Department: 2814)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

C257S620000, C257SE21238

Reexamination Certificate

active

07618877

ABSTRACT:
In a semiconductor wafer including a plurality of element forming regions formed on a front surface of a semiconductor substrate, a scribe line groove is formed along a periphery of the each of the element forming regions, and stoppers are located at an intersection of the scribe line groove, so as to block the scribe line groove.

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