Semiconductor wafer material removal apparatus and method...

Details Semiconductor wafer material removal apparatus and method... Semiconductor wafer material removal apparatus and method...

2006-05-23

2006-05-23

Rose, Robert A. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S041000

Reexamination Certificate

active

07048608

ABSTRACT:
A system for applying a microtopography to a semiconductor wafer (“wafer”) is provided. The system includes a chuck configured to hold and rotate the wafer. The system also includes a grinding wheel disposed over the chuck in a proximately adjustable manner relative to the wafer to be held by the chuck. The grinding wheel is configured to rotate about a central axis of the grinding wheel, wherein the central axis of the grinding wheel is non-parallel to the central axis of the chuck. The grinding wheel is capable of contacting the wafer and removing material from the wafer at the area of contact. Appropriate application of the grinding wheel to the wafer serves to generate a microtopography across the wafer surface. The resulting microtopography can then be planarized more effectively by conventional chemical mechanical planarization methods.

REFERENCES:
patent: 6265314 (2001-07-01), Black et al.
patent: 6280292 (2001-08-01), Sato et al.
patent: 6450859 (2002-09-01), Moyer

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