Semiconductor wafer boat with reduced wafer contact area

Heating – Accessory means for holding – shielding or supporting work... – Support structure for heat treating ceramics

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

432258, 211 4118, F27D 500

Patent

active

060993022

ABSTRACT:
A boat for semiconductor wafers has reduced contact surface area with the wafer, thereby preventing distortion of the wafer during heating. The boat has an upper member; a lower member, a plurality of wafers being loaded between the upper member and the lower member; and a plurality of support members vertically extended between and connecting the upper member to the lower member for supporting the wafers. A plurality of slots are successively and horizontally formed in each of the support members, and the peripheral edge of the wafer is inserted therein, wherein a hemisphere-shaped protrusion is formed inside the slot, and the bottom surface of the wafer contacts and is supported by each hemisphere-shaped protrusion at a single contact point.

REFERENCES:
patent: 4407654 (1983-10-01), Irwin
patent: 5310339 (1994-05-01), Ushikawa
patent: 5718574 (1998-02-01), Shimazu
patent: 5820367 (1998-10-01), Osawa
patent: 5931666 (1999-08-01), Hengst

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor wafer boat with reduced wafer contact area does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor wafer boat with reduced wafer contact area, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor wafer boat with reduced wafer contact area will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1144573

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.