Semiconductor wafer, apparatus and process for producing the...

Details Semiconductor wafer, apparatus and process for producing the... Semiconductor wafer, apparatus and process for producing the...

2011-01-11

2011-01-11

Morgan, Eileen P. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With feeding of tool or work holder

C451S041000, C451S057000, C451S063000, C451S262000, C451S269000, C451S287000

Reexamination Certificate

active

07867059

ABSTRACT:
The invention relates to a process for producing a semiconductor wafer by double-side grinding of the semiconductor wafer, in which the semiconductor wafer is simultaneously ground on both sides, first by rough-grinding and then by finish-grinding, using a grinding tool. The semiconductor wafer, between the rough-grinding and the finish-grinding, remains positioned in the grinding machine, and the grinding tool continues to apply a substantially constant load during the transition from rough-grinding to finish-grinding. The invention also relates to an apparatus for carrying out the process and to a semiconductor wafer having a local flatness value on a front surface of less than 16 nm in a measurement window of 2 mm×2 mm area and of less than 40 nm in a measurement window of 10 mm×10 mm area.

REFERENCES:
patent: 3885925 (1975-05-01), Tatar
patent: 5942445 (1999-08-01), Kato et al.
patent: 6066565 (2000-05-01), Kuroki et al.
patent: 6114245 (2000-09-01), Vandamme et al.
patent: 6458688 (2002-10-01), Wenski et al.
patent: 6861360 (2005-03-01), Wenski et al.
patent: 6997776 (2006-02-01), Kann et al.
patent: 7077726 (2006-07-01), Pietsch et al.
patent: 7137874 (2006-11-01), Bovio et al.
patent: 2002/0081943 (2002-06-01), Hendron et al.
patent: 2003/0060020 (2003-03-01), Walitzki et al.
patent: 2003/0060050 (2003-03-01), Pietsch et al.
patent: 2003/0171075 (2003-09-01), Nihonmatsu et al.
patent: 2004/0038544 (2004-02-01), Zhang et al.
patent: 0 868 974 (1998-10-01), None
patent: 52-143593 (1977-11-01), None
patent: 11-254312 (1999-09-01), None
patent: 11-254313 (1999-09-01), None
patent: 200198068 (2000-07-01), None
patent: 2001-107686 (2001-12-01), None
patent: 2003-32700 (2003-04-01), None
patent: 99/39873 (1999-08-01), None
patent: 2001/078125 (2001-10-01), None
English Patent Abstract of Japan corresponding to JP2000-198068A.

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