Semiconductor wafer and method for making the same

Details Semiconductor wafer and method for making the same Semiconductor wafer and method for making the same

2008-06-03

2008-06-03

Zarneke, David A (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

With peripheral feature due to separation of smaller...

C257SE23179

Reexamination Certificate

active

07382038

ABSTRACT:
A semiconductor wafer includes a plurality of active circuit die areas, each of which being bordered by a dicing line through which the plurality of active circuit die areas are separated from each other by mechanical wafer dicing. WAT pads are disposed along the dicing line. Each of the WAT pads has thereon a slot opening. A reinforcement structure is formed within the slot opening and penetrates through the WAT pad for stopping propagation of de-lamination during wafer dicing.

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Michael Quirk and Julian Serda, Semiconductor Manufacturing Technology, Prentice Hall, pp. 214-222.

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