Semiconductor wafer anchoring device

Details Semiconductor wafer anchoring device Semiconductor wafer anchoring device

1996-12-13

1998-12-01

Smith, James G.

Work holders

With fluid means

Vacuum-type holding means

269296, 269 25, 269289R, B25B 1100

Patent

active

058426906

ABSTRACT:
A semiconductor wafer anchoring device, which includes a platen having a flat upper surface adapted for mounting a semiconductor wafer thereon, an elastic O-ring located between the platen and the semiconductor wafer, and a clamp disposed to face with the O-ring, which is adapted for pressing upon the upper surface of the semiconductor wafer and for anchoring same. The clamp is a ring-type plate having an inner diameter larger than the diameter of the semiconductor wafer, and having a plurality of protrusions projecting from each quadrant of an inner circumferential surface of the ring-type plate toward the center thereof, an end of each protrusion being adapted to be positioned between a chip pattern and the edge of the semiconductor wafer.

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