Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2011-08-30
2011-08-30
Desire, Gregory M (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
C324S750010, C324S757030, C324S762050, C382S144000
Reexamination Certificate
active
08009895
ABSTRACT:
A semiconductor wafer analysis system is provided. In an embodiment, the semiconductor wafer analysis system includes a tester to test semiconductor wafers manufactured by at least one manufacturing facility, a wafer map generation module to generate wafer maps on the basis of the test results from the tester, and a wafer analysis module. The wafer analysis module may include a data generation module that divides each wafer map into a plurality of defect analysis regions and generates feature vectors representing the semiconductor wafers, and an operation module that statistically analyzes the feature vectors.
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Hong Seok-Woo
Lee Chang-Huhn
Desire Gregory M
F. Chau & Associates LLC
Samsung Electronics Co,. Ltd.
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