Semiconductor wafer alignment member and clamp ring

Details Semiconductor wafer alignment member and clamp ring Semiconductor wafer alignment member and clamp ring

1995-11-29

1999-01-19

Krizek, Janice L.

Work holders

Work-underlying support

Movable roller

118729, 414935, B23Q 0300

Patent

active

058606408

ABSTRACT:
A semiconductor processing chamber includes a substrate support member on which a substrate and a clamp ring are aligned during processing in the chamber. To align the substrate on the support member, a frustoconical substrate alignment member extends about the perimeter of the substrate receiving surface of the support member to capture a substrate received in the chamber and center the substrate on the upper surface of the support member. The alignment member includes an alignment face thereon, which urges a substrate into alignment with the substrate receiving face of the support member as the substrate is deposited on the support member. To clamp the substrate in proper alignment on the support member and flatten any warpage in the substrate, a clamp ring alignment member is provided which aligns and supports a clamp ring on a substrate without causing significant shadowing of the substrate. The clamp ring is vertically and laterally aligned relative to the support member and substrate centered thereon. The clamp ring alignment member is preferably a plurality of adjustable alignment pins positioned in the outer perimeter of the support member.

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patent: 5516367 (1996-05-01), Lei et al.
IBM Technical Disclosure Bulletin, Self-Aligning, Low Adhesion Clamp-Ring Assembly, Dec. 1988, No. 7, two pages.
European Search Report -Application No. 93 11 744.
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European Search Report -Application No. EP 90 10 6959.
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