Semiconductor wafer

Details Semiconductor wafer Semiconductor wafer

1994-11-15

1995-12-19

Carroll, J.

Active solid-state devices (e.g., transistors, solid-state diode

Test or calibration structure

257773, 257775, 437226, H01L 2906

Patent

active

054770629

ABSTRACT:
A semiconductor wafer is formed with a plurality of semiconductor chips each having a plurality of ICs or LSIs, a plurality of scribe lines formed between the semiconductor chip areas for dicing the plurality of ICs or LSIs as semiconductor chips, and a plurality of test elements formed on the scribe lines for testing the performance of basic elements and the quality of manufacturing processes. A plurality of slits intersecting with the scribe line are formed at a predetermined pitch in the test element serving as a test electrode a probe for electrical measurement contacts.

REFERENCES:
patent: 4695868 (1987-09-01), Fisher
patent: 4835592 (1989-05-01), Zommer
patent: 5003374 (1991-03-01), Vokoun, III
patent: 5051807 (1991-09-01), Morozumi
patent: 5096855 (1992-03-01), Vokoun, III
patent: 5206181 (1993-04-01), Gross

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