Semiconductor thin films

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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1566162, 15662071, 156DIG73, 156DIG64, 156DIG88, 437247, 437976, C30B 102, C30B 2960

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048530760

ABSTRACT:
An improved method and apparatus for optimizing the electrical properties while crystallizing material is disclosed. In this invention, a material which is to be crystallized is formed on a substrate and subjected to a heat treatment to intentionally induce thermal stress while crystallizing the material. The heat treatment melts the material being crystallized and when the material solidifies, a built-in stress is retained which, in the case of n-doped Si on fused silica results in a tensile stress which produces an electron mobility in the film of 870 cm.sup.2 /volt-sec as compared to similarly fashioned unstressed n-doped Si on SiO.sub.2 coated Si which has an electron mobility of 500 cm.sup.2 /volt-sec.

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