Semiconductor test apparatus

Error detection/correction and fault detection/recovery – Pulse or data error handling – Memory testing

Reexamination Certificate

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Details

C714S719000, C714S736000, C714S738000, C714S742000, C324S073100, C365S201000

Reexamination Certificate

active

06766483

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a semiconductor test apparatus for implementing testing of a semiconductor through a plurality of electrode pins.
2. Description of the Related Art
FIG. 12
is a block diagram showing a conventional semiconductor test apparatus. In the figure, reference numeral
10
is the measured device (hereinbelow, referred to as a DUT), and the semiconductor test apparatus measures a waveform obtained by applying a test waveform to each of the electrode pins
12
-
1
,
12
-
1
, . . .
12
-n, of this DUT
10
, or measures a waveform generated by the DUT
10
. Then, by comparing this measured result to an expected value, measurement of the DUT or a determination of product acceptance or rejection is carried out. The test blocks
60
-
1
,
60
-
2
, . . . ,
60
-n apply a test signal to each pin of the DUT
10
or input a test signal generated by the DUT
10
. The control circuit
54
controls the data and the operational timing of this plurality of test blocks
60
-
1
to
60
-n based on the control of the host CPU.
Next, the operation of this conventional semiconductor test apparatus will be explained for the case in which the test waveform sent to the electrode pins
12
-
1
to
12
-n is a digital signal. First, a timing generating circuit
53
generates the timing of the data applied to the DUT
10
or received from the DUT
10
. The reading or writing of the content of the data memory
55
is carried out in synchronism with the clock of the PLL circuit
59
depending on the content of the control memory
56
. Here, the digital pattern applied to the DUT
10
and the amount of delay for indicating the phase of this digital signal are written into the data memory
55
. The content of the control for multiple execution of an indicated arbitrary portion of the content of the data memory
55
is written into the control memory
56
.
The data read out from the data memory
55
is input into the delay circuit
57
via the control circuit
54
. The delay circuit
57
generates a digital signal having an indicated delay value in synchronism with the output clock of the PPL circuit
59
based on the pattern data and the delay amount setting data output from the control circuit
54
, and this is input into the pin
12
-
1
of the DUT
10
via the DUT driver
58
.
The test blocks
60
-
2
to
60
-n are identical circuits, and the signals respectively generated thereby are input into the electrode pins
12
-
2
to
12
-n of the DUT
10
. Moreover, although not illustrated in the figure, the signals generated by the DUT
10
are respectively written into the data memory
55
-
1
to
55
-n in a sequence opposite to that of the signal flow described above. Then the differences between these signals and the expected values are written into the respective data memory
55
-
1
to
55
-n. In addition, although not illustrated in the figure, an identical operation is carried out for analog signals or a power source.
However, in such a conventional semiconductor test apparatus, because the exchange of the signals between each of the test blocks
60
-
1
to
60
-n must be carried out via the control circuit
54
and real time processing in synchronism with a clock is necessary, there are the problems that the structure of this control circuit
54
becomes complicated and large in scale, and in addition, providing both data memory
55
and control memory
56
, which is the timing memory, is necessary.
In addition, the data memory
55
and the control memory
56
must carry out reading and writing in real time, and thus the use, for example, of memory that requires a refresh operation such as dynamic RAM is difficult, and furthermore, treating data that exceeds the capacity of the data memory
55
and the control memory
56
for a particular pin is difficult. Thus, there is the problem that in order to resolve these difficulties in conventional technology, the capacity of the memory must be increased, or the output signals of the other test blocks must be switched and output by the control circuit
54
.
Furthermore, in order to transfer data from the host CPU to the memory of each of the blocks
60
-
1
to
60
-n, signal switching control for transferring data to the object blocks
60
-
1
to
60
-n via the control circuit
54
is necessary. In addition, the control circuit and devices must be changed depending on the type (analog or digital) of the signals of the DUT
10
. In addition, there is the inconvenience that depending on the number of signals of the DUT
10
, the number of circuits must be increased arbitrarily.
SUMMARY OF THE INVENTION
In order to resolve the above described problems, it is an object of the present invention to provide a semiconductor test apparatus whose structure does not use a complicated or large scale control circuit or control memory, can reduce the circuits for real time processing, and at the same time allows use of refresh memory, can allot a large amount of data to a particular electrode pin of the measured device without adding memory, and can realize this in a comparatively simple structure.
In order to attain the above-described object, a semiconductor test apparatus according to the present invention provides a plurality of test blocks that comprise a data processing apparatus (in the present embodiments, the digital signal processor (DSP) and the microprocessor (CPU)) provided for each of the electrode pins of the measured device, memory that stores test pattern data, the delay amount setting data, and the control pattern data, and carries out reading and writing of this data under the control of the data processing apparatus, a first-in-first-out element that executes the queue processing of the serial signals that are the serially processed data read out from the memory, a delay circuit that delays the output signal of the first-in-first-out elements at a timing in synchronism with a reference clock, and a measured device driver that inputs the output signal of the delay circuit into the electrode pins of the measured device, and in which the data processing apparatus of each of the adjacent test blocks are connected together into a loop via an input-output circuit provided on each of these test blocks.
In addition, the semiconductor test apparatus according to the present invention provides a plurality of test blocks comprising a data processing apparatus provided for each of the electrode pins of the measured device, memory that stores the expected value data and the phases of the measured device, and carries out the reading and writing of the data under the control of the data processing apparatus, first-in-first-out element that executes queue processing of the serial signals that are serially processed data read out from the memory, and a measured device receiver that compares the expected value data obtained from the first-in-first-out element to output signals received from the electrode pin of the measured device, outputs a signal indicating whether or not they agree, and stores the result in the memory via the first-in-first-out element, and in which the data processing apparatus of each of these adjacent test blocks are connected together into a loop via the input/output circuit provided on each of the test blocks.
In addition, the semiconductor test apparatus according to the present invention provides a plurality of test blocks comprising a data processing apparatus provided for each of the electrode pins of the measured device, memory that stores the test pattern data, the delay amount setting data, and the control pattern data, and carries out reading and writing of the waveform data of the data under the control of the data processing apparatus, a first-in-first-out element that executes queue processing of serial signals that are serially processed data read from the memory, and a digital/analog conversion circuit that converts the output signal of the first-in-first-out element to an analog signal and inputs the result into the electrode pins of the measured device

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