Semiconductor substrate treating method

Details Semiconductor substrate treating method Semiconductor substrate treating method

1988-09-29

1990-09-11

Pal, Asok

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156612, C30B 2302, C30B 2510, F24H 100

Patent

active

049560468

ABSTRACT:
A reaction system and process for uniformly heating semiconductor substrates and a device for supporting the same and direct conductive heating of IC wafers within a reactor are described. The substrate is held in direct contact with the heating source positioned within the reactor. The heat source is a thermal delivery module made of material such as solid silicon carbide, or high temperature material containing resistive heating elements. The heat is uniformly transferred to the walls of the module by a molten metal having a low melting point and high boiling point such as essentially indium or bismuth or a eutectic of indium and bismuth.

REFERENCES:
patent: 2897331 (1959-07-01), McFarlane et al.
patent: 3083286 (1963-03-01), Swetlitz
patent: 3391270 (1968-07-01), Harris et al.
patent: 3505499 (1970-04-01), Walther
patent: 3536893 (1970-10-01), Cranley
patent: 3623712 (1971-11-01), McNeilly
patent: 3673785 (1972-06-01), Drugmand et al.
patent: 3815575 (1974-06-01), Danis
patent: 3983359 (1976-09-01), Walker et al.
patent: 4047496 (1977-09-01), McNeilly et al.
patent: 4081313 (1978-03-01), McNeilly et al.
patent: 4456186 (1984-06-01), Ando
patent: 4496609 (1985-01-01), McNeilly et al.
patent: 4504329 (1985-03-01), Quinlan et al.
patent: 4579609 (1986-04-01), Reif et al.
patent: 4778559 (1988-10-01), McNeilly
Soviet Inventions Illustrated, Section E1:Electrical Week 8627, Aug. 13, 1985, p. 20.
Soviet Inventions Illustrated, Section Ch: Chemical, Week E06 Mar. 24, 1982, p. 16.

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