Semiconductor substrate polishing methods and equipment

Details Semiconductor substrate polishing methods and equipment Semiconductor substrate polishing methods and equipment

2007-04-17

2007-04-17

Deo, Duy-Vu N (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C438S691000, C438S692000, C438S693000

Reexamination Certificate

active

10952655

ABSTRACT:
According to one aspect of the present invention, a method of electrochemically polishing a semiconductor substrate may be provided. A semiconductor substrate processing fluid, having a plurality of abrasive particles therein, may be placed between the surface of the semiconductor substrate and the polish head. The polish head may be moved relative to the surface of the semiconductor substrate to cause the abrasive particles to polish the surface of the semiconductor substrate. According to a second aspect of the present invention, a method for electro-polishing a semiconductor substrate may be provided. A semiconductor substrate may be placed in an electrolytic solution. A surface of the semiconductor substrate may be contacted with at least one conductive member. A voltage may be applied across the electrolytic solution and the at least one conductive member. The at least one conductive member may be moved across the surface of the semiconductor substrate.

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Landolt, D., Review Article: Fundamental Aspects Of Electropolishing, Electrochimica Acta, The Journal Of The International Society Of Electrochemistry, vol. 32, no date.
No. 1, Jan. 1987, pp. 1-11, Pergamon Journals Ltd., Printed in Great Britain.

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