Semiconductor substrate cleaning solutions, methods of forming t

Details Semiconductor substrate cleaning solutions, methods of forming t Semiconductor substrate cleaning solutions, methods of forming t

1997-02-27

1998-12-08

McGinty, Douglas J.

Cleaning compositions for solid surfaces, auxiliary compositions

Cleaning compositions or processes of preparing

For cleaning a specific substrate or removing a specific...

510375, 510370, 134 2, 134 3, 134 13, 134 41, 134 42, C11D 754, C11D 726, C11D 728, B08B 308

Patent

active

058469214

ABSTRACT:
Cleaning solutions for application to semiconductor substrates comprise hydrofluoric acid, hydrogen peroxide, isopropyl alcohol, and water. Methods of cleaning semiconductor substrates comprise contacting the semiconductor substrates having contaminants contained thereon with cleaning solutions comprising hydrofluoric acid, hydrogen peroxide, isopropyl alcohol, and water; contacting the semiconductor substrates with first baths of water to remove the cleaning solutions contained on the semiconductor substrates; contacting the semiconductor substrates with second baths containing water to remove the contaminants contained on the semiconductor substrates; and rotating the semiconductor substrates to remove water remaining thereon to clean the semiconductor substrates.

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