Semiconductor substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...

Reexamination Certificate

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Details

C257S751000, C257S758000

Reexamination Certificate

active

11039956

ABSTRACT:
A semiconductor substrate is partitioned along scribing lines so as to form a plurality of IC regions encompassed by seal rings, wherein a passivation opening is formed in the scribing line in which a monitoring element is formed within a monitoring element region, which is encompassed by secondary seal rings, which are constituted by metal layers, oxidation layers and via holes. The secondary seal rings are formed to encompass the periphery of the monitoring element, which can thus precisely monitor characteristics of integrated circuits because it is possible to prevent water and impurities from infiltrating into the monitoring element region which is thus stabilized in characteristics.

REFERENCES:
patent: 7129566 (2006-10-01), Uehling et al.
patent: 2006/0082003 (2006-04-01), Shizuno
patent: 57-113241 (1982-07-01), None
patent: 59-014663 (1984-01-01), None
patent: 05-121793 (1993-05-01), None
patent: 07-037839 (1995-02-01), None

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