Semiconductor structures and methods for fabricating...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation

Reexamination Certificate

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C438S287000, C438S785000

Reexamination Certificate

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11066887

ABSTRACT:
Semiconductor structures, and methods for fabricating semiconductor structures, comprising high dielectric constant stacked structures are provided. A stacked dielectric structure (16) in accordance with one exemplary embodiment of the present invention has a first amorphous dielectric layer (18) comprising HfXZr1-XO2, where 0≦X≦1. An amorphous interlayer (20) overlies the first amorphous dielectric layer. The interlayer has a net dielectric constant that is approximately no less than the dielectric constant of HfZrO4. A second amorphous dielectric layer (22) overlies the interlayer. The second amorphous dielectric layer comprises HfYZr1-YO2, where 0≦Y≦1. The stacked dielectric structure (16) has a net dielectric constant that is approximately no less than the dielectric constant of HfZrO4.

REFERENCES:
patent: 6392257 (2002-05-01), Ramdani et al.
patent: 6407435 (2002-06-01), Ma et al.
patent: 6562491 (2003-05-01), Jeon
patent: 6627503 (2003-09-01), Ma et al.
patent: 6791125 (2004-09-01), Demkov et al.
patent: 6825506 (2004-11-01), Chau et al.
patent: 7045815 (2006-05-01), Yu et al.
patent: 7078785 (2006-07-01), Ciancio et al.
patent: 2005/0142715 (2005-06-01), Sakoda et al.
patent: 2005/0186687 (2005-08-01), Lee et al.
Ushakov et al., “Effect of La and Y on Crystallization Temperatures of Hafnia and Zirconia,” J. Mater. Res., vol. 19, No. 3, Mar. 2004. pp. 693-696.
Jensen et al., “X-ray Reflectivity Characterization of ZnO/Al2O3Multilayers Prepared by Atomic Layer Deposition,” Chem. Mater. 2002, 14, pp. 2276-2282.

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