Semiconductor structure with lining layer partially etched...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S312000, C257S314000, C257S315000, C438S257000, C438S593000

Reexamination Certificate

active

07034354

ABSTRACT:
A semiconductor structure with partially etched gate and method of fabricating the same. A semiconductor structure with a single-sided or dual-sided partially etched gate comprises a gate dielectric layer, a gate conductive layer and a cap layer sequentially stacked on a substrate to form a gate structure, and a lining layer disposed on sidewalls of the gate structure, wherein the lining layer is partially etched to expose the adjacent gate structure. In addition, an inter-layer dielectric layer covers the gate structure and a contact is formed in the inter-layer dielectric layer, exposing the substrate and a portion of the gate structure therein, wherein the lining layer of the exposed portion of the gate structure is partially removed.

REFERENCES:
patent: 6191444 (2001-02-01), Clampitt et al.
patent: 6239011 (2001-05-01), Chen et al.
patent: 6281076 (2001-08-01), Choi et al.
patent: 6348709 (2002-02-01), Graettinger et al.
patent: 6660581 (2003-12-01), Yang et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor structure with lining layer partially etched... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor structure with lining layer partially etched..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor structure with lining layer partially etched... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3583639

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.