Semiconductor structure made using improved simultaneous...

Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Ion implantation of dopant into semiconductor region

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S527000, C438S513000, C438S514000, C118S7230AN

Reexamination Certificate

active

08008175

ABSTRACT:
Methods and apparatus provide for: a first source of plasma (first plasma), which includes a first species of ions, directing the first plasma out along a first axis; a second source of plasma (second plasma), which includes a second, differing, species of ions, directing the second plasma out along a second axis; and an accelerator system in communication with the first and second sources of plasma, and operating to: (i) accelerate the first species of ions at a first magnitude therethrough, and toward a semiconductor wafer, and (ii) simultaneously accelerate the second species of ions at a second magnitude, different from the first magnitude, therethrough, and toward the semiconductor wafer.

REFERENCES:
patent: 3310443 (1967-03-01), John et al.
patent: 4914292 (1990-04-01), Tamai et al.
patent: 5189303 (1993-02-01), Tanjyo et al.
patent: 5350926 (1994-09-01), White et al.
patent: 5374564 (1994-12-01), Bruel
patent: 5854123 (1998-12-01), Sato et al.
patent: 5966620 (1999-10-01), Sakaguchi et al.
patent: 5985742 (1999-11-01), Henley et al.
patent: 6010579 (2000-01-01), Henley et al.
patent: 6013563 (2000-01-01), Henley et al.
patent: 6027988 (2000-02-01), Cheung et al.
patent: 6146979 (2000-11-01), Henley et al.
patent: 6150239 (2000-11-01), Goesele et al.
patent: 6155909 (2000-12-01), Henley et al.
patent: 6160262 (2000-12-01), Aoki et al.
patent: 6162705 (2000-12-01), Henley et al.
patent: 6211041 (2001-04-01), Ogura
patent: 6245645 (2001-06-01), Mitani et al.
patent: 6251754 (2001-06-01), Ohshima et al.
patent: 6274459 (2001-08-01), Chan
patent: 6300227 (2001-10-01), Liu et al.
patent: 6303468 (2001-10-01), Aspar et al.
patent: 6312797 (2001-11-01), Yokokawa et al.
patent: 6344404 (2002-02-01), Cheung et al.
patent: 6350702 (2002-02-01), Sakaguchi et al.
patent: 6429104 (2002-08-01), Auberton-Herve
patent: 6458671 (2002-10-01), Liu et al.
patent: 6458672 (2002-10-01), Henley et al.
patent: 6468884 (2002-10-01), Miyake et al.
patent: 6486008 (2002-11-01), Lee
patent: 6544862 (2003-04-01), Bryan
patent: 6548382 (2003-04-01), Henley et al.
patent: 6566233 (2003-05-01), Yokokawa et al.
patent: 6597039 (2003-07-01), Ohmi et al.
patent: 6610582 (2003-08-01), Stewart
patent: 6613678 (2003-09-01), Sakaguchi et al.
patent: 6653209 (2003-11-01), Yamagata
patent: 6852652 (2005-02-01), Maa et al.
patent: 6927148 (2005-08-01), Ito
patent: 7166524 (2007-01-01), Al-Bayati et al.
patent: 7176528 (2007-02-01), Couillard et al.
patent: 7291545 (2007-11-01), Collins et al.
patent: 7323398 (2008-01-01), Akatsu
patent: 7326628 (2008-02-01), Mohamed et al.
patent: 7449394 (2008-11-01), Akatsu et al.
patent: 7456080 (2008-11-01), Gadkaree
patent: 7608521 (2009-10-01), Cites et al.
patent: 7737013 (2010-06-01), Yin et al.
patent: 2002/0064924 (2002-05-01), Cheung et al.
patent: 2002/0100880 (2002-08-01), Chen et al.
patent: 2003/0183876 (2003-10-01), Takafuji et al.
patent: 2004/0038504 (2004-02-01), Ito
patent: 2004/0171196 (2004-09-01), Walitzki
patent: 2004/0171232 (2004-09-01), Cayrefourcq et al.
patent: 2004/0214434 (2004-10-01), Atwater et al.
patent: 2004/0229444 (2004-11-01), Couillard et al.
patent: 2004/0232488 (2004-11-01), Forbes
patent: 2005/0026650 (2005-02-01), Russell
patent: 2005/0032330 (2005-02-01), Ghyselen et al.
patent: 2005/0040073 (2005-02-01), Cody et al.
patent: 2005/0042842 (2005-02-01), Lei et al.
patent: 2005/0070071 (2005-03-01), Henley et al.
patent: 2005/0079664 (2005-04-01), Faris
patent: 2005/0085049 (2005-04-01), Atwater, Jr. et al.
patent: 2005/0098742 (2005-05-01), Kellerman et al.
patent: 2005/0196936 (2005-09-01), Daval et al.
patent: 2006/0038227 (2006-02-01), Aitken et al.
patent: 2007/0281440 (2007-12-01), Cites et al.
patent: 11-329996 (1999-11-01), None
patent: 2005/029576 (2005-03-01), None
patent: 2006/023289 (2006-03-01), None
F. Kroner, et al., “Phosphorus Ion Shower Implantation for Special Power IC Application,” IEEE, 2000, pp. 476-479.
Agarwal et al., Efficient production of silicon-on-insulator films by co-implantation of He+ with H+, Applied Physics Letters, 1998, vol. 72, No. 9, pp. 1086-1088.
V. C. Venezia, et al, “The Role of Implantation Damage In The Production of Silicon-On-Insulator Films by Co-Implantation of He and H” Electrochemical Society Proceedings vol. 981 pp. 1385.
M. K. Weldon, et al, “Mechanism of silicon exfoliation induced by hydrogen/helium c⊖implantation”, Applied Physics Letters vol. 73, No. 25, Dec. 21, 1998.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor structure made using improved simultaneous... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor structure made using improved simultaneous..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor structure made using improved simultaneous... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2783731

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.