Semiconductor structure and method of manufacture

Details Semiconductor structure and method of manufacture Semiconductor structure and method of manufacture

2005-10-24

2008-09-30

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Entirely of metal except for feedthrough

C257S787000

Reexamination Certificate

active

07429790

ABSTRACT:
A semiconductor structure (100) includes a substrate (110) having a first surface (111) with a mold lock feature (101). The semiconductor structure also includes a semiconductor chip (120) located over the first surface of the substrate. The semiconductor structure further includes an electrical isolator structure (340) located over the first surface of the substrate. The electrical isolator structure includes an electrical lead (341, 342) and an electrically insulative element (343) molded to the electrical lead. An optional portion (444) of the electrical isolator structure is located in the mold lock feature. The semiconductor structure additionally includes an adhesive element (450) located between and coupling the electrical isolator structure and the first surface of the substrate.

REFERENCES:
patent: 3778887 (1973-12-01), Suzuki et al.
patent: 4994897 (1991-02-01), Golubic et al.
patent: 5138430 (1992-08-01), Gow et al.
patent: 5278446 (1994-01-01), Nagaraj et al.
patent: 5378924 (1995-01-01), Liang
patent: 5701034 (1997-12-01), Marrs
patent: 6072211 (2000-06-01), Miller et al.
patent: 6072238 (2000-06-01), Visawanthan et al.
patent: 6261868 (2001-07-01), Miller et al.
patent: 6511866 (2003-01-01), Bregante et al.
patent: 6713849 (2004-03-01), Hasebe et al.
patent: 6867367 (2005-03-01), Zimmerman
patent: 6943433 (2005-09-01), Kamada
patent: 7224047 (2007-05-01), Carberry et al.
patent: 2006/0108673 (2006-05-01), Germain et al.
patent: 9-107059 (1997-04-01), None

Affiliated with

Also associated with

Rating

Semiconductor structure and method of manufacture does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor structure and method of manufacture, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor structure and method of manufacture will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3979886