Semiconductor structure and method of assembly

Details Semiconductor structure and method of assembly Semiconductor structure and method of assembly

2005-10-24

2008-11-04

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Entirely of metal except for feedthrough

C257S725000

Reexamination Certificate

active

07446411

ABSTRACT:
A semiconductor structure (100, 900) includes a substrate (110) having a surface (111) and also includes one or more semiconductor chips (120) located over the substrate surface. The semiconductor structure further includes an electrical isolator structure (340) located over the substrate surface, where the electrical isolator structure includes one or more electrical leads (341, 342) and an organic-based element (343) molded to the electrical leads. The semiconductor structure also includes a solder element (350) coupling together the electrical isolator structure and the substrate surface.

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International Search Report and Written Opinion.

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