Semiconductor stacked device for implantable medical apparatus

Details Semiconductor stacked device for implantable medical apparatus Semiconductor stacked device for implantable medical apparatus

1998-08-28

2000-04-18

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

257786, H01L 2348, H01L 2352, H01L 2940

Patent

active

060518871

ABSTRACT:
A stacked semiconductor device is formed with a first mounting substrate, e.g., a single metal layer die tape, having a first semiconductor die attached thereto and a second mounting substrate, e.g., a double metal layer die tape having a second semiconductor die attached thereto. Substantially columnar solder connections, each formed from two solder balls are used to stack the first mounting substrate and the second mounting substrate such that the second semiconductor die is positioned between the mounting substrates. For example, identical memory dice may be stacked in this manner or different types of die such as a processor die and a memory die may be stacked in this manner for use in implantable medical apparatus.

REFERENCES:
patent: 5198888 (1993-03-01), Sugano
patent: 5514907 (1996-05-01), Moshayedi
patent: 5594275 (1997-01-01), Kwon et al.
patent: 5608265 (1997-03-01), Kitano et al.
patent: 5763939 (1998-06-01), Yamashita
patent: 5854507 (1998-12-01), Miremadi et al.
patent: 5861666 (1999-01-01), Bellar
patent: 5883426 (1999-03-01), Tokuno et al.

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