Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent
1994-11-04
1997-06-10
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
257685, 257690, 257700, H01L 2302, H01L 2348, H01L 23053
Patent
active
056379188
ABSTRACT:
A semiconductor stack including a base member and a semiconductor assembly member provided on the base member. The semiconductor assembly member includes a switching element having a first, a second and a third terminal, mounted on a surface of the base member such that the first, second and third terminals of the switching element are led to a same plane, and a batch laminated conductor positioned on the first, second and third terminals of the switching element, composed of superimposition of a first, a second and a third conductor and insulators for insulating between adjacent two of the conductors. The semiconductor assembly member also includes a first, a second and a third connecting device for connecting the first, second and third conductors and the first, second and third terminals of the switching element, respectively. The first, second and third connecting devices thrust through the batch laminated conductor in a state in which the first, second and third connecting devices are electrically connected to the first, second and third conductors and are insulated from the second and third conductors, the first and third conductors and the first and second conductors, respectively.
REFERENCES:
patent: 5300811 (1994-04-01), Suzuki et al.
patent: 5426566 (1995-06-01), Beilstein, Jr. et al.
patent: 5432729 (1995-07-01), Carson et al.
Kabushiki Kaisha Toshiba
Saadat Mahshid D.
Wallace Valencia M.
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