Semiconductor single crystal ingot cutting jig

Details Semiconductor single crystal ingot cutting jig Semiconductor single crystal ingot cutting jig

1996-10-22

1998-09-01

Rose, Robert A.

Stone working

Work supports

451364, 451460, 269 7, B24B 4106

Patent

active

057996440

ABSTRACT:
A semiconductor single crystal ingot cutting jig is shaped as a cylinder having a diameter approximately equal to an ingot diameter. A recess is provided at one end of the jig for receiving a head (or tail) of the ingot. An adhesive is provided in the recess so as to adhere the ingot to the jig when the head (or tail) of the ingot is inserted into the recess. Then, the ingot is fixed on a bed of a band-saw slicing machine. The head (or tail) of the ingot is fixed on the jig and thus will not overturn at the time just before finishing the cutting or at the end of cutting. This can prevent a blade of a band saw slicing machine from being damaged.

REFERENCES:
patent: 4227348 (1980-10-01), Demers
patent: 4819387 (1989-04-01), Harbarger
patent: 4903681 (1990-02-01), Honda et al.
patent: 5024207 (1991-06-01), Harbarger et al.
patent: 5367837 (1994-11-01), Tolkowsky
patent: 5413521 (1995-05-01), Terashima et al.

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