Semiconductor sealant of epoxy resin and organic polymer-grafted

Details Semiconductor sealant of epoxy resin and organic polymer-grafted Semiconductor sealant of epoxy resin and organic polymer-grafted

1998-01-29

1999-10-05

Sellers, Robert E.

Stock material or miscellaneous articles

Composite

Of epoxy ether

428416, 428901, 525476, 525902, B32B 2704, B32B 2738, C08L 6304

Patent

active

059621397

ABSTRACT:
An epoxy resin molding material comprising an epoxy resin, a phenolic resin and a powder flexibilizer which has a core-shell structure composed of a solid silicone core and an organic polymer shell is an epoxy resin molding material for sealing electronic parts.

REFERENCES:
patent: 5147947 (1992-09-01), Yamamoto et al.
patent: 5312878 (1994-05-01), Shiobara et al.
Patent Abstracts of Japan, vol. 12, No. 72 (E-588) (2919). Mar. 1988.

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