Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure
Patent
1995-11-17
1998-05-12
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Test or calibration structure
257203, 257620, 257208, 257210, 257207, H01L 2350, H01L 2704, H01L 2718, G01R 3102
Patent
active
057510156
ABSTRACT:
A semiconductor test chip including a plurality of test functions. The test functions of the semiconductor test chip include bond pad pitch and size effects on chip design, wire bond placement accuracy regarding placement of the wire bond on the bond pad, evaluation of bond pad damage (cratering) effect on the area of the chip below the bond pad during bonding of the wire on the bond pad, street width effects regarding the use of thinner saw cuts in cutting the individual chips from the wafer, thermal impedance effects for thermal testing capabilities, ion mobility evaluation capabilities and chip on board in flip chip application test capabilities.
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Corbett Tim J.
Gonzalez Fernando
Scholer Raymond P.
Crane Sara W.
Micro)n Technology, Inc.
Williams Alexander Oscar
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