Coating apparatus – Gas or vapor deposition – Multizone chamber
Patent
1996-03-07
1999-11-02
Bueker, Richard
Coating apparatus
Gas or vapor deposition
Multizone chamber
118725, 118728, 118730, C23G 1600
Patent
active
059762608
ABSTRACT:
It is an object of the present invention to obtain a vacuum chucking which can vacuum suck a wafer even if dusts attach thereon. The main body of vacuum chuck (101) has a plurality of block grooves (125) on the surface on which the wafer (1) is sucked and fixed, in which vacuum evacuation paths (105) each for vacuum evacuating each block groove (125) are provided for each block groove (125). When the wafer (1) is sucked and fixed under low pressure, even if the degree of vacuum in one of the block grooves (125) decreases due to attachment of dusts on part of the suction surface, or the like, the wafer (1) can surely be sucked and held.
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Eshima Taizo
Iwamoto Takeshi
Kanda Tomoyuki
Kinoshita Yoshimi
Kitano Katsuhisa
Bueker Richard
Mitsubishi Denki & Kabushiki Kaisha
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