Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With workpiece support
Reexamination Certificate
2005-10-18
2005-10-18
Mills, Gregory (Department: 1763)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With workpiece support
C156S345520, C156S345530, C118S715000, C118S724000, C118S725000, C118S728000, C204S298010, C204S298020, C204S298310
Reexamination Certificate
active
06955741
ABSTRACT:
The present application provides a PECVD reaction chamber for processing semiconductor wafers comprising a susceptor for supporting a semiconductor wafer inside the reaction chamber wherein the susceptor comprises a plurality vertical through-bores, a moving means for moving the susceptor vertically between at least a first position and a second position, wafer-lift pins passing through the through-bores wherein the lower end of each wafer pin is attached to a lift member, and a lift member linked with an elevating mechanism for moving the wafer-lift pins vertically. The disclosed apparatus reduces contamination on the underside of the semiconductor wafer.
REFERENCES:
patent: 4134255 (1979-01-01), McBain et al.
patent: 4724621 (1988-02-01), Hobson et al.
patent: 4764076 (1988-08-01), Layman et al.
patent: 4790258 (1988-12-01), Drage et al.
patent: 4842683 (1989-06-01), Cheng et al.
patent: 4902531 (1990-02-01), Nakayama et al.
patent: 4908095 (1990-03-01), Kagatsume et al.
patent: 4951601 (1990-08-01), Maydan et al.
patent: 5034199 (1991-07-01), Zavracky et al.
patent: 5060354 (1991-10-01), Chizinsky
patent: 5100502 (1992-03-01), Murdoch et al.
patent: 5199483 (1993-04-01), Bahng
patent: 5226056 (1993-07-01), Kikuchi et al.
patent: 5252807 (1993-10-01), Chizinsky
patent: 5310453 (1994-05-01), Fukasawa et al.
patent: 5352294 (1994-10-01), White et al.
patent: 5366002 (1994-11-01), Tepman
patent: 5444217 (1995-08-01), Moore et al.
patent: 5460684 (1995-10-01), Saeki et al.
patent: 5516367 (1996-05-01), Lei et al.
patent: 5556476 (1996-09-01), Lei et al.
patent: 5558736 (1996-09-01), Lee et al.
patent: 5566744 (1996-10-01), Tepman
patent: 5589224 (1996-12-01), Tepman et al.
patent: 5611865 (1997-03-01), White et al.
patent: 5665166 (1997-09-01), Deguchi et al.
patent: 5683518 (1997-11-01), Moore et al.
patent: 5695568 (1997-12-01), Sinha et al.
patent: 5710407 (1998-01-01), Moore et al.
patent: 5800686 (1998-09-01), Littau et al.
patent: 5856240 (1999-01-01), Sinha et al.
patent: 5882419 (1999-03-01), Sinha et al.
patent: 5935338 (1999-08-01), Lei et al.
patent: 5994678 (1999-11-01), Zhao et al.
patent: 6113704 (2000-09-01), Satoh et al.
patent: 6146463 (2000-11-01), Yudovsky et al.
patent: 6374508 (2002-04-01), Yudovsky et al.
patent: 6416647 (2002-07-01), Dordi et al.
patent: 288992632 (1999-10-01), None
patent: 2001135713 (2001-05-01), None
ASM Japan K.K.
Kackar Ram N
Knobbe Martens Olson & Bear LLP
Mills Gregory
LandOfFree
Semiconductor-processing reaction chamber does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor-processing reaction chamber, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor-processing reaction chamber will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3443605