Material or article handling – Apparatus for moving material between zones having different...
Reexamination Certificate
2005-05-31
2005-05-31
Kramer, Dean J. (Department: 3652)
Material or article handling
Apparatus for moving material between zones having different...
C414S805000, C414S939000
Reexamination Certificate
active
06899507
ABSTRACT:
Semiconductor processing equipment that has increased efficiency, throughput, and stability, as well as reduced operating cost, footprint, and faceprint is provided. Other than during deposition, the atmosphere of both the reaction chamber and the transfer chamber are evacuated using the transfer chamber exhaust port, which is located below the surface of the semiconductor wafer. This configuration prevents particles generated during wafer transfer or during deposition from adhering to the surface of the semiconductor wafer. Additionally, by introducing a purge gas into the transfer chamber during deposition, and by using an insulation separating plate 34, the atmospheres of the transfer and reaction chambers can be effectively isolated from each other, thereby preventing deposition on the walls and components of the transfer chamber. Finally, the configuration described herein permits a wafer buffer mechanism to be used with the semiconductor processing equipment, thereby further increasing throughput and efficiency.
REFERENCES:
patent: 4828224 (1989-05-01), Crabb et al.
patent: 4889609 (1989-12-01), Cannella
patent: 4895107 (1990-01-01), Yano et al.
patent: 4949783 (1990-08-01), Lakios et al.
patent: 4951601 (1990-08-01), Maydan et al.
patent: 4990047 (1991-02-01), Wagner et al.
patent: 5071460 (1991-12-01), Fujiura et al.
patent: 5080549 (1992-01-01), Goodwin et al.
patent: 5121705 (1992-06-01), Sugino
patent: 5186718 (1993-02-01), Tepman et al.
patent: 5192371 (1993-03-01), Shuto et al.
patent: 5199483 (1993-04-01), Bahag
patent: 5217501 (1993-06-01), Fuse et al.
patent: 5223001 (1993-06-01), Saeki
patent: 5229615 (1993-07-01), Brune et al.
patent: 5286296 (1994-02-01), Sato et al.
patent: 5388944 (1995-02-01), Takanabe et al.
patent: 5391035 (1995-02-01), Krueger
patent: 5433785 (1995-07-01), Saito
patent: 5462397 (1995-10-01), Iwabuchi
patent: 5516732 (1996-05-01), Flegal
patent: 5520742 (1996-05-01), Ohkase
patent: 5520743 (1996-05-01), Takahashi
patent: 5538390 (1996-07-01), Salzman
patent: 5571330 (1996-11-01), Kyogoku
patent: 5586585 (1996-12-01), Bonora et al.
patent: 5609459 (1997-03-01), Muka
patent: 5609689 (1997-03-01), Kato et al.
patent: 5611655 (1997-03-01), Fukasawa et al.
patent: 5613821 (1997-03-01), Muka et al.
patent: 5630690 (1997-05-01), Salzman
patent: 5651868 (1997-07-01), Canady et al.
patent: 5664925 (1997-09-01), Muka et al.
patent: 5683072 (1997-11-01), Ohmi et al.
patent: 5697750 (1997-12-01), Fishkin et al.
patent: 5730801 (1998-03-01), Tepman et al.
patent: 5752796 (1998-05-01), Muka
patent: 5784799 (1998-07-01), Kato et al.
patent: 5785796 (1998-07-01), Lee
patent: 5788447 (1998-08-01), Yonemitsu et al.
patent: 5810538 (1998-09-01), Ozawa et al.
patent: 5810942 (1998-09-01), Narayanswami et al.
patent: 5820692 (1998-10-01), Baecker et al.
patent: 5855681 (1999-01-01), Mayden et al.
patent: 5857848 (1999-01-01), Takahashi et al.
patent: 5879459 (1999-03-01), Gadgil et al.
patent: 5882165 (1999-03-01), Mayden et al.
patent: 5882413 (1999-03-01), Beaulieu et al.
patent: 5883017 (1999-03-01), Tepma et al.
patent: 5885675 (1999-03-01), Martin
patent: 5897710 (1999-04-01), Sato et al.
patent: 5900105 (1999-05-01), Toshima
patent: 5913978 (1999-06-01), Kato et al.
patent: 5934856 (1999-08-01), Asakawa et al.
patent: 5970717 (1999-10-01), Tateyama
patent: 5974682 (1999-11-01), Akimoto
patent: 5975740 (1999-11-01), Lin et al.
patent: 5976312 (1999-11-01), Shimizu et al.
patent: 6000227 (1999-12-01), Krocker
patent: 6022586 (2000-02-01), Hashimoto et al.
patent: 6042623 (2000-03-01), Edwards
patent: 6045315 (2000-04-01), Azumano et al.
patent: 6048154 (2000-04-01), Wytman
patent: 6053686 (2000-04-01), Kyogoku
patent: 6053980 (2000-04-01), Suda et al.
patent: 6063203 (2000-05-01), Satoh
patent: 6071055 (2000-06-01), Tepman
patent: 6073366 (2000-06-01), Aswad
patent: 6074538 (2000-06-01), Ohmi et al.
patent: 6096135 (2000-08-01), Guo et al.
patent: 6106634 (2000-08-01), Ghanayem et al.
patent: 6108937 (2000-08-01), Raaijmakers
patent: 6113704 (2000-09-01), Satoh et al.
patent: 6120605 (2000-09-01), Sato
patent: 6154301 (2000-11-01), Harvey
patent: 6162299 (2000-12-01), Raaijmakers
patent: 6193803 (2001-02-01), Sato et al.
patent: 6224312 (2001-05-01), Sundar
patent: 6224679 (2001-05-01), Sasaki et al.
patent: 6234107 (2001-05-01), Tanaka et al.
patent: 6236903 (2001-05-01), Kim et al.
patent: 6261048 (2001-07-01), Muka
patent: 6264804 (2001-07-01), Lee et al.
patent: 6280134 (2001-08-01), Nering
patent: 6283060 (2001-09-01), Yamazaki et al.
patent: 6286230 (2001-09-01), White et al.
patent: 6305898 (2001-10-01), Yamagishi et al.
patent: 6312525 (2001-11-01), Bright et al.
patent: 6464825 (2002-10-01), Shinozaki
patent: 6488775 (2002-12-01), Shimizu et al.
patent: 6488778 (2002-12-01), Ballantine et al.
patent: 6536136 (2003-03-01), Saga
patent: 6551045 (2003-04-01), Binnard et al.
patent: 6609869 (2003-08-01), Aggarwal et al.
patent: 6709521 (2004-03-01), Hiroki
patent: 2001/0041122 (2001-11-01), Kroeker
patent: 2003/0160239 (2003-08-01), Shinagawa et al.
patent: 2003/0219977 (2003-11-01), Pomarede et al.
patent: 0 209 150 (1987-01-01), None
patent: 1 139 393 (2001-04-01), None
patent: 06-275703 (1994-09-01), None
patent: WO 94/14185 (1994-06-01), None
patent: WO 01/04935 (2001-01-01), None
Suwada Masaei
Watanabe Takeshi
Yamagishi Takayuki
ASM Japan K.K.
Knobbe Martens Olson & Bear LLP
Kramer Dean J.
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