Semiconductor process

Details Semiconductor process Semiconductor process

1976-01-05

1978-04-04

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

148 627, 148 63, 156659, 156665, C23F 102

Patent

active

040826040

ABSTRACT:
A process for improving the continuity of overlayers above an aluminum metallization stripe on a semiconductor device which includes the step of forming a conversion coating on the surface of the aluminium metallization. The conversion coating has a higher etch rate than the aluminum per se, and hence after selective masking, a tapered or sloped edge is produced on the aluminum stripe which is more easily continuously overlayed by the further necessary layers.

REFERENCES:
patent: 3825454 (1974-07-01), Kikuchi et al.

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