Semiconductor pressure sensor with spacing member disposed betwe

Details Semiconductor pressure sensor with spacing member disposed betwe Semiconductor pressure sensor with spacing member disposed betwe

1997-04-15

1998-02-24

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

257417, H01L 2982

Patent

active

057214468

ABSTRACT:
In a semiconductor pressure sensor reducing the stress applied by a thick film substrate and preventing the rising of a die bonding material, a sensor chip having a thin wall diaphragm is fixed to a thick film substrate by a die bonding material, such as silicone resin. A convex member of a glass material is interposed between the thick film substrate and the sensor chip and fixed by the die bonding material. With this arrangement, unintended deformation of the diaphragm of the sensor chip can be prevented and a highly accurate, less expensive semiconductor pressure sensor can be provided.

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