Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1989-04-27
1989-12-26
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
296211, 73708, 73721, 156651, 156657, 1566591, 156662, 338 4, 428156, H01L 21306, B44C 122, C03C 1500, C03C 2506
Patent
active
048895903
ABSTRACT:
A piezo-resistive pressure sensor element is formed in the front face of a silicon wafer. A thin diaphragm is formed under the sensing element by anisotropically etching a cavity from the rear face of the wafer. The rear face (cavity-side) rupture pressure of the silicon diaphragm is at least doubled by subjecting the anisotropically etched cavity to a mild isotropic etch. This substantially improves the cavity-side over-pressure rating of the finished pressure sensor without any significant change in the device sensitivity or allows higher sensitivity to be obtained for the same over-pressure rating or intermediate combinations thereof.
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Staller Joseph M.
Tucker Robert L.
Handy Robert M.
Motorola Inc.
Powell William A.
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