Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation
Patent
1993-03-01
1993-11-30
Mintel, William
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Physical deformation
257419, 257687, 257788, 257791, 73517R, 73726, 437219, 437224, H01L 2984
Patent
active
052668274
ABSTRACT:
A semiconductor pressure sensor assembly, comprising a receptacle having a floor and including a first cavity recessed within a first portion of the floor, and a second cavity recessed within a second portion of the floor and connected to the first cavity at a first junction. A semiconductor pressure sensor is within the first cavity, and a plurality of bonding pads are disposed about a periphery of a top surface of the pressure sensor chip other than at a location of the first junction, a plurality of external conducting terminals are disposed about a periphery of the receptacle other than at the location of the first junction, and a plurality of wires connect the external conducting terminals to respective ones of the bonding pads. A gelatinous material is within the first and second cavities, and the second cavity serves as a first work region from which an excess of the gelatinous material within the first cavity can be removed.
REFERENCES:
patent: 4249034 (1981-02-01), Fichot et al.
patent: 4723899 (1988-02-01), Osada
patent: 4850227 (1989-07-01), Luehgen et al.
patent: 4895026 (1990-01-01), Tada
patent: 5173766 (1992-12-01), Long et al.
Fuji Electric & Co., Ltd.
Mintel William
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