Semiconductor power transmission device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Reexamination Certificate

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Details

C257S718000, C257S719000, C257S726000, C257S727000, C257SE23086

Reexamination Certificate

active

11053021

ABSTRACT:
A semiconductor power circuit in which multiple field effect transistor dies are solder connected between opposed contact surfaces of overlying flat conductors and are clamped by means of spring clips which are arranged in symmetrically opposed relationship. A circuit board also disposed between the clamped surfaces is protected from the clamping forces by means of a soft paper layer with holes registering with similar holes in the circuit board to permit solder pads to pass there through.

REFERENCES:
patent: 4261005 (1981-04-01), McCarthy
patent: 4575038 (1986-03-01), Moore
patent: 4710852 (1987-12-01), Keen
patent: 4872089 (1989-10-01), Ocken et al.
patent: 5130888 (1992-07-01), Moore
patent: 5592021 (1997-01-01), Meschter et al.
patent: 5747877 (1998-05-01), Wilson
patent: 6476481 (2002-11-01), Woodworth et al.
patent: 6600652 (2003-07-01), Chandran et al.

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