Abrading – Precision device or process - or with condition responsive... – Computer controlled
Patent
1995-05-26
1997-01-28
Kisliuk, Bruce M.
Abrading
Precision device or process - or with condition responsive...
Computer controlled
451 6, 451 8, 451285, B24B 4900, B24B 5100
Patent
active
055973418
ABSTRACT:
To planarize an insulating film formed on a semiconductor substrate, a polishing slurry containing cerium oxide is used to polish the surface of the insulating film. Using the cerium oxide included slurry as a polishing agent, the insulating film is not contaminated by alkali metal is during the polishing process. Furthermore, the insulating film is polished at an enhanced polishing rate.
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Aoki Riichirou
Kodera Masako
Okano Haruo
Shigeta Atsushi
Yajima Hiromi
Banks Derris H.
Kabushiki Kaisha Toshiba
Kisliuk Bruce M.
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