Semiconductor planarizing apparatus

Abrading – Precision device or process - or with condition responsive... – Computer controlled

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451 6, 451 8, 451285, B24B 4900, B24B 5100

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active

055973418

ABSTRACT:
To planarize an insulating film formed on a semiconductor substrate, a polishing slurry containing cerium oxide is used to polish the surface of the insulating film. Using the cerium oxide included slurry as a polishing agent, the insulating film is not contaminated by alkali metal is during the polishing process. Furthermore, the insulating film is polished at an enhanced polishing rate.

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