Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2009-03-26
2010-11-23
Menz, Laura M (Department: 2813)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
C438S051000, C438S052000
Reexamination Certificate
active
07838320
ABSTRACT:
A method for manufacturing a semiconductor physical quantity sensor having a fixed portion, a movable portion and an output terminal includes: forming a metal layer on a semiconductor layer; forming a resist on the metal layer; forming an opening and a side etching hole in the resist; anisotropically etching the metal layer via the opening and the hole; anisotropically etching the semiconductor layer via the opening so that the fixed portion is formed in the semiconductor layer; and side etching the metal layer from the opening and the hole so that the output terminal is formed on a part of the fixed portion, and a metal member is formed on another part of the fixed portion in such a manner that the metal member is electrically separated from the output terminal.
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Denso Corporation
Menz Laura M
Posz Law Group , PLC
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