Semiconductor photoreceptor device

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Reexamination Certificate

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Details

C257SE31127, C385S012000

Reexamination Certificate

active

07875943

ABSTRACT:
A semiconductor light detecting device includes an n-contact layer selectively disposed on an Fe—InP substrate. An optical waveguide layer is disposed on the n-contact layer and includes an n-cladding layer, a light absorption layer, and a p-cladding layer, laminated on one another over the n-contact layer, in that order. An Fe—InP current blocking layer is disposed on the n-cladding layer such that sides of the optical waveguide layer are buried in the Fe—InP current blocking layer. A p-electrode includes a contact electrode electrically connected to the p-cladding layer of the optical waveguide layer, a lead-out electrode portion extending on a side wall of the current blocking layer from the contact electrode and extending on the Fe—InP substrate, and an electrode pad disposed on a surface of the Fe—InP substrates with an SiN film between the electrode pad and the surface of the Fe—InP substrate and connected to the lead-out electrode portion.

REFERENCES:
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patent: 5825047 (1998-10-01), Ajisawa et al.
patent: 6734519 (2004-05-01), Nakaji et al.
patent: 2004/0056250 (2004-03-01), Wang et al.
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patent: 2004-146408 (2004-05-01), None
patent: 2004-152942 (2004-05-01), None
patent: 2004-165529 (2004-06-01), None
T. Aoyagi et al., “40 Gbps Waveguide Photodiode for Flip-Chip Assembly”, OFC' 97 vol. 6, p. 37, Tu13, (1997).

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