Semiconductor pellet having plural chips

Details Semiconductor pellet having plural chips Semiconductor pellet having plural chips

1997-08-29

2000-07-18

Fahmy, Wael

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

257723, H01L 2348

Patent

active

060911565

ABSTRACT:
A semiconductor pellet comprising first and second semiconductor chips being diced from a wafer, a first bonding-pad formed at a first peripheral portion of said first chip, and a second bonding-pad formed at second peripheral portion of said second chip, which bonding-pads are arranged so as to keep symmetry after rotating around the central point of said pellet by 180 degrees. Judging whether the first chip is good or not and if the chip is not good, then the pellet is rotated around the central point thereof by 180 degrees, and it is mounted onto a chip carrier. Then wire-bonding is conducted.

REFERENCES:
patent: 5153507 (1992-10-01), Fong et al.
patent: 5616931 (1997-04-01), Nakamura et al.

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