Semiconductor packages and methods of fabricating the same

Details Semiconductor packages and methods of fabricating the same Semiconductor packages and methods of fabricating the same

2009-02-09

2010-10-05

Nguyen, Ha Tran T (Department: 2829)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C438S108000, C438S107000, C438S456000

Reexamination Certificate

active

07807512

ABSTRACT:
A semiconductor package and module, and methods of fabricating the same are provided. A method of fabricating a semiconductor package may include bonding rear surfaces of first and second semiconductor chips to each other, each of the semiconductor chips having chip pads exposed on front surfaces. The method may also include forming an encapsulation portion configured to encapsulate side surfaces of the bonded semiconductor chips, forming via plugs configured to pass through the encapsulation portion, forming an insulating layer configured to expose surfaces of the chip pads and the via plugs on the exposed surfaces of the two semiconductor chips and surfaces of the encapsulation portion, and forming package pads on the exposed surfaces of the chip pads and the surfaces of the via plugs.

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