Semiconductor package with transparent window and fabrication me

Details Semiconductor package with transparent window and fabrication me Semiconductor package with transparent window and fabrication me

1996-01-02

1999-03-02

Zarabian, A.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With window means

257710, H01L 2302

Patent

active

058775463

ABSTRACT:
An improved semiconductor package with a transparent window and a fabrication method thereof having a transparent window formed at a central portion of a semiconductor apparatus not providing a ceramic upper plate and adhesive, which includes a semiconductor chip; a ceramic plate for receiving the semiconductor chip; a lead frame sealed with the ceramic plate, the lead frame being angled and curved; a transparent window mounted on the upper portion of the lead frame; and a sealant provided at the ceramic plate and a side surface of the transparent window.

REFERENCES:
patent: 4760440 (1988-07-01), Bigler
patent: 4961106 (1990-10-01), Butt
patent: 5550398 (1996-08-01), Kocian et al.

Affiliated with

Also associated with

Rating

Semiconductor package with transparent window and fabrication me does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor package with transparent window and fabrication me, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package with transparent window and fabrication me will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-425507