Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2006-10-03
2006-10-03
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S127000
Reexamination Certificate
active
07115441
ABSTRACT:
A method of manufacturing a semiconductor package, including: preparing a first semiconductor chip, where a plurality of first central electrode pads are formed along a center of an active surface of the first semiconductor chip, preparing a second semiconductor chip, where a plurality of second central electrode pads are formed along a center region of an active surface of the second semiconductor chip, and a plurality of edge electrode pads are formed along an edge of the second semiconductor chip, attaching the second semiconductor chip to a substrate, connecting electrically the edge electrode pads of the second semiconductor chip to the substrate, encapsulating the connection between the edge electrode pads and the substrate, forming a plurality of metal bumps on the central electrode pads of the second semiconductor chip, and stacking the first semiconductor chip on the second semiconductor chip so that the first central electrode pads of the first semiconductor chip attach to the respective second central electrode pads of the second semiconductor chip via the metal bumps.
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Geyer Scott B.
Harness & Dickey & Pierce P.L.C.
Samsung Electronics Co,. Ltd.
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