Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate
2011-06-28
2011-06-28
Arroyo, Teresa M (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
C257S737000, C257S738000, C257S780000
Reexamination Certificate
active
07969024
ABSTRACT:
A semiconductor package with improved joint reliability and a method of fabricating the semiconductor package are disclosed. A conductive connector may be formed on a surface of a semiconductor wafer on which semiconductor devices may be arranged. A first insulating layer including a first opening through which a portion of the connection pad is exposed may be formed on the connection pad and the semiconductor wafer. A rewiring line electrically connected to an exposed portion of the connection pad may be formed on the first insulating layer. A second insulating layer including a second opening through which a portion of the rewiring line is exposed may be formed on the rewiring line and the first insulating layer. A connection terminal including one or more entangled wires may be formed on an exposed portion of the rewiring line so as to be electrically connected to the rewiring line.
REFERENCES:
patent: 6215670 (2001-04-01), Khandros
patent: 6489182 (2002-12-01), Kwon
patent: 2001/0026954 (2001-10-01), Takao
patent: 2005/0040540 (2005-02-01), Haba et al.
patent: 2005/0064740 (2005-03-01), Brodsky et al.
patent: 2005/0098891 (2005-05-01), Wakabayashi et al.
patent: 2007/0085220 (2007-04-01), Hortaleza
patent: 2009/0315177 (2009-12-01), Chung et al.
patent: 10-0422346 (2004-02-01), None
patent: 10-0444163 (2004-08-01), None
patent: 10-0596766 (2006-06-01), None
An English language abstract of Korean Publication No. KR 10-2001-4085, published Jan. 15, 2001.
An English language abstract of Korean Publication No. KR 10-2002-94593, published Dec. 18, 2002.
An English language abstract of Korean Publication No. 10-2003-56220, published Jul. 4, 2003.
Cho Jae-shin
Chung Hyun-soo
Hwang Seong-deok
Kim Jum-gon
Kim Ki-hyuk
Arroyo Teresa M
Harness Dickey & Pierce PLC
Samsung Electronics Co,. Ltd.
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