Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate
2005-02-22
2005-02-22
Niebling, John F. (Department: 2812)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
C257S676000, C257S709000, C257S783000
Reexamination Certificate
active
06858942
ABSTRACT:
A semiconductor package includes a relatively thin substrate epoxy attached to a packaging substrate, such as a lead frame. A relatively thick semiconductor epoxy is attached to a semiconductor. The relatively thin substrate epoxy and the relatively thick semiconductor epoxy are attached to one another forming a stack including the packaging substrate, the relatively thin substrate epoxy, the relatively thick semiconductor epoxy, and the semiconductor. A housing encloses the stack.
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Anderson Sydney Larry
Cheah Eng-Chew
Altera Corporation
Morgan & Lewis & Bockius, LLP
Niebling John F.
Roman Angel
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