Semiconductor package with high density I/O lead connection

Details Semiconductor package with high density I/O lead connection Semiconductor package with high density I/O lead connection

1986-05-27

1988-09-27

Pellinen, A. D.

Electricity: electrical systems and devices

Miscellaneous

361404, 361403, 357 70, 174 52FD, H05K 502

Patent

active

047746351

ABSTRACT:
Disclosed is a semiconductor package which permits coupling of semiconductor bond pads to I/O leads where a high density of connections is needed. Conductive fingers backed by an insulating tape are bonded to the ends of the fingers on a lead frame. The tape fingers are electrically coupled to the bond pads on one major surface of the semiconductor chip by wire bonding. In one embodiment, the opposite major surface of the chip is bonded to a paddle on the lead frame through an aperture in the tape for maximum heat dissipation.

REFERENCES:
patent: Re31967 (1985-08-01), Burns
patent: 4371912 (1983-02-01), Guzik
patent: 4480013 (1984-10-01), Doi et al.
patent: 4498122 (1985-02-01), Rainal
patent: 4578697 (1986-03-01), Takamae
patent: 4631820 (1986-12-01), Harada et al.
U.S. patent application of Moyer and Scholz, Ser. No. 816,443 filed Jan. 6, 1986.

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