Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2005-02-01
2005-02-01
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S713000, C257S717000, C257S723000, C257S718000, C257S706000
Reexamination Certificate
active
06849942
ABSTRACT:
A semiconductor package with a heat sink is provided in which at least one chip is mounted on the substrate and covered by a heat sink. The heat sink is formed with a flange in contact with the substrate, allowing a plurality of clip members to clamp the flange of the heat sink and the substrate. Each of the clip members has a recess portion for receiving the flange of the heat sink and the substrate to thereby firmly position the heat sink on the substrate. The clip members are engaged with edges of the heat sink and the substrate, thereby not affecting trace routability on the substrate. Moreover, the heat sink is mounted on the substrate and would not be dislocated.
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Hsiao Cheng-Hsu
Huang Chien Ping
Lin Chang-Fu
Pu Han-Ping
Corless Peter F.
Edwards & Angell LLP
Flynn Nathan J.
Forde Remmon R.
Jensen Steven M.
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